DOWSIL™ 3-4680 Silicone Gel is suitable for potting and protecting PCB assemblies, especially those with delicate components. Benefits include fast room temperature cure or heat-accelerated cure if faster processing is desired. DOWSIL™ 3-4680 is part of a special class of encapsulants that cure in place to an extremely soft material to provide cushioning, self-healing and resiliency. This allows the product to retain much of the stress relief and self-healing qualities of a liquid while providing the dimensional stability of an elastomer; exceptionally beneficial for delicate components by providing protection to circuits and connections from thermal and mechanical stresses. Additionally, DOWSIL™ 3-4680 provides excellent isolation of circuits from the harmful effects of moisture and other contaminants and provides electrical insulation from high voltages.