The 3M Embedded Capacitance Material is a thin, high-performance dielectric layer designed to deliver distributed capacitance for low-impedance power delivery and EMI reduction in compact electronic assemblies. Built as a ceramic-filled epoxy film laminated between copper layers, it helps reduce power bus noise, improve decoupling, and lower discrete capacitor count. Available in sheet form for PCB integration, it supports very low profile designs while enhancing signal integrity and thermal stability. Ideal for high-speed boards, this capacitance material offers reliable performance in demanding electronic applications where space-saving, noise suppression, and stable electrical characteristics are critical.