Star Technology’s LA-821 ReleasEze III is a wipe-on masking compound for Dip & Bake or VPI processes. This compound can be used with either 100% Epoxy based or water based epoxy products and withstands temperatures up to 280 °C. ReleasEze is used to prevent adhesion of epoxies and varnishes to mechanical surfaces such as shafts, threaded bars and drilled and tapped holes. This compound can be wiped off with a cloth when the curing process is complete and the item has cooled to an ambient temperature.
